Etching
DRIE
- Oxford 100 ICP
- SiC
Dry Isotropic
- XACTIX X2 XeF2
- Selective Silicon isotropic dry etch
Wet Etching
- 5 wet chemical (acids and bases) processing stations with neutralization tank
- KOH etch station with temperature controlled bath
- Etch Chemicals Available: HF, BOE, HCl, Al Etch, Au Etch, Cr Etch, Phosphoric Acid, Nitric Acid, Sulfuric Acid, H2O2, NaOH, KOH
- Etchant Recipes A-Z
- Etch rates for micromachining processing, Part I
- Williams et. al, 1996
- Etch rates for micromachining processing, Part II
- Williams et. al, 2003