Electromask CC250

Retired

The electromask has been retired and replaced with the Heidelberg.

  • Accepts DXF/GDSII/CIF/PG/EM file formats
  • Criss Cross pattern generator, 2.5 um minimum feature size
  • 5x reticle step and repeat pattern generator, 1 um minimum feature size
  • 3" x 3", 4" x 4", 5" x 5", 6" x 6", 7" x 7" chromium masks
  • Light field or dark field

 

Software:

  • L-Edit CAD Layout Software
  • AutoCAD software
  • Intellisuite and Cadence design and simulation software (CADE lab)
  • DXF/GDSII/CIF/PG/EM file software conversion tools 

Procedure:

Procedure:

MASK MAKING STEPS

Consult with Nanofab staff regarding microfabrication process flow and mask design.

Decide where to make mask

  1. Min Feature Size > 3 um
    1. Curves and circles
      1. http://www.photoplotstore.com/(if min feature size > 10 um)
        1. ~$150 per plastic mask Photoplot Film Pricing
        2. ~$300 per chromium on glass mask Photoplot Glass Mask Pricing
      2. http://www.photo-sciences.com/(min feature size 3-10 um)
        1. ~$500 per mask Photosciences Chromium on Glass Pricing
      3. http://www.abeamtech.com/(min feature size 3-10 um)
        1. ~$500 per mask AbeamTech Chromium on Glass Pricing
      4. Compugraphics
        1. http://www.omgi.com/contact-losgatos.html (min feature size is from 3-10 um)
        2. ~$500 per mask
    2. Rectangular features only
      1. Electromask PG in Microfab
        1. Cost = $35 + price of mask + equipment time
  2. Min Feature size 1-3 um
    1. Curves and circles
      1. Compugraphics
    2. Electromask IR in Microfab
      1. Somewhat difficult, direct write to wafer is best
  3. Min feature size < 1 um
    1. Physics e-beam writer, direct write to wafer (very small areas only)
      1. http://www.physics.utah.edu/index.php/facilities/sem

Design mask using AutoCad or LEdit

Mask size depends on wafer size, typically:

  1. 2” and 3” diameter wafers: 4” mask
  1. 4” diameter wafers: 5” mask
  1. 6” diameter wafers: 7” mask

Mask polarity depends on deposition and etch processing:

  1. Liftoff using positive photoresist – Dark field (Transparent where film should remain after liftoff)
  1. Etching using positive photoresist – Light field (Opaque where film should remain after etch)

Transfer mask into gds format

E-mail gds file to outside vendor

If making mask in house, translate file to EM format.

Contact Brian or Kevin for training on the Electromask system.

Location

Equipment Status

√ Tool is Up

Reservations Calendar

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