MEI Wedge
- Designed for:
- Ultrasonic wedge bonding
- Thermosonic wedge bonding
- Thermocompression wedge bonding
- Of:
- IC's
- Hybrids
- Microwave devices
- Laser diodes
- Using gold or aluminum wire from .5 mil (12.5 microns) to 3 mil (76 microns) and ribbon.
Manufacturer Information: