The Utah Nanofab provides technical staffing, oversight and administrative systems supporting the MEB Microfab as it transitions through 2014 into the new 18,000 ft2 cleanroom Nanofab in the SMBB. The Nanofab also staffs, supports and administers the surface analysis and nano-scale imaging instrumentation located in the Micron Microscopy Suite of the SMBB. The Micron Microscopy Suite is home to several other tools and instruments as well, which are associated with other campus recharge centers, including the Health Sciences Center Electron Microscopy Core, and the Nanomaterials Characterization Facility.
"The Utah Nanofab advances leading edge research, and facilitates economic growth by providing world-class nanofabrication facilities, infrastructure, and staff to academia and industry."
"The Utah Nanofab will become a recognized leader in innovation and a premier nanotechnology center with an interface to biomedical sciences. Through the efforts of the Utah Nanofab, the frontiers of research will be expanded, the next generation of engineers and leaders will be educated, and economic growth will be supported by the sustainable transfer of technology into meaningful commercialization outcomes."
Empowering, Serving and Safeguarding the Nanofab Community
We believe exceptional quality and accessibility reinforce our commitment to serve as a core facility. We support collaboration by building partnerships across academic disciplines, business and industry. We create an environment that is conducive to learning, innovation, and success. We serve as a catalyst for economic development in Utah and beyond. We enable the academic and local industrial community with a strong commitment to excellence in research and innovation.
We seek effective and efficient ways to better serve our lab members. We strive to provide quality tools, technologies, processes, and facilities for learning, understanding, and developing new technology. We anticipate the needs of those we serve and offer proactive and flexible solutions. We are motivated to initiate and adapt to change for improving our work and community.
We instill a discipline of safety throughout our facility and in all aspects of our work. We are committed to providing a safe work environment through training, communication, and quality resources.
We are committed to sustaining credible, reliable, and trusted professional staff. We honor commitments and take pride in our work. Lab members are treated with courtesy, respect, appropriate confidentiality, and dignity. We believe teamwork provides the foundation for continuous improvement to our systems for the benefit of both lab members and employees.
We are pleased to offer the popular 3-week hands-on short course, Scanning Electron Microscopy: Lectures: When: Tuesdays Dec 3, 10, 17 Time: 11am - noon Where: SMBB Sorenson USTAR building, second floor (large conference room or auditorium, depending on attendance) Lab: sessions each week to be scheduled when the student roster is established Cost: $120. If a company is paying for the registration fee, the price is $300. You can elect to be trained on either the Quanta ESEM (Hi-vac, low-vac modes) or the Hitachi S4800 (Hi-vac, hi-res). After this training we expect you will be proficient enough to use the instrument by yourself following one more one-on-one session with your own samples. This training or the equivalent (+ 50 hrs stick time) is required as a pre-requisite for learning to use the dual-beam Focused Ion Beam (FIB/SEM) instrument. Instrument descriptions are located at: http://coral.nanofab.utah.edu/lab/equipment You may register for the course at the following link: http://www.nanofab.utah.edu/signups/short_courses/fall_sem_2013/
Today, we sent out the Fall 2013 edition of our quarterly newsletter. You may view that newsletter and our previous newsletters by browsing through the news items in the archive. If you are not on our mailing list, please sign up so we can keep you posted.
Dear Lab Members,
When Intel came to us recruiting in late September, they were very impressed with our new cleanroom and microscopy facilities and asked that we prepare our students better to enter the tech manufacturing workforce by teaching our students the tools of everyday engineering: statistical experimental design, or in the jargon "Design of Experiments" (DOE), and Statistical Process Control (SPC).
DOE is a means of designing efficient and cost effective experiments to determine principal effects of process variables on performance outcomes, and also identifying interactions between variables. It is highly complementary to mechanistic approaches of experimental design that we normally teach in academic environments, and many graduate students have found the technique helpful in expediting their own graduate research with higher confidence in the results and conclusions.
SPC is the main tool for evaluating and reducing sources of manufacturing variability; hence SPC is the main engineering technique for reducing cost and improving quality in volume manufacturing.
Please note that Intel’s message is the same message given to us by Micron, IMFT and Fairchild, and also other volume tech manufacturers like Merit Sensors and Blackrock Micro. This is why the College of Engineering has re-started the course ME/ECE 6055/5055 Microsystems Design and Characterization with Engineering Initiative Funding. Our instructor, Dr. Jim Smith, is opening up the section of that course dealing with DOE/SPC, so that all Nanofab lab members may participate. This segment is once again taught by student-favorite, visiting lecturer Jim Pugmire, Staff Statistician at Fairchild Semiconductor, our local semiconductor partner. If you wish to become conversant in critical tools for experimental design, either to benefit your own research, or to not look stupid sitting in interview sessions, then come join us:
Three lectures, 8 to 8:50 am. WEB 2250.
One of five lab sessions, limited space available. You must RSVP sign up here for one of the following lab sessions.
For access, you need to complete BOTH specific training on the new photolithography tools with Brian Baker, and walk-through safety training with Tony Olsen (see links in the news item below).
This is not to be confused with the GRAND opening, which will occur when we finish moving all functions from MEB to the USTAR cleanroom of the Utah Nanofab.
We have completed installation of the first photolithography tools, including EV 420, photomask patterning (Heidelberg), and several spinners, including one with autodispense.
Over the next few weeks we will be taking down and relocating the remaining research photolithography capability (Suss aligner and wet benches), leaving the teaching lab photolithography capabilities intact until the very last move cycle.
Tony Olsen will be leading safety training sessions to introduce participants to the new protocols and safety issues in our cleanroom in SMBB. Any lab members who need access to the cleanroom will be required to attend a safety training session first. Please visit the safety training registration page to find a time slot that fits your schedule.
If you are visiting our cleanroom in order to use our photolithography tools, you will need to also attend one of the photolithography sessions that will be hosted by Brian Baker.
|Tool Name||Date to be disconnected||Date to be operational*|
|EV 420 Aligner||08/22/13||09/12/13|
|EVG 520 IS Wafer Bonder||08/22/13||09/12/13|
|Heidelberg MicroPG 101 Mask Writer||09/03/13||09/12/13|
|Laser Mark 4000 Nd-YAG||08/22/13||09/05/13|
|Optec Micromaster KrF||08/22/13||09/05/13|
|Strasbaugh 6EC CMP||08/22/13||09/05/13|
* Subject to inspection and occupancy approval
To support the contractor work and utility connection in the SMBB nanofab we will need to disconnect and move equipment. The first items moving are the EV 420 aligner and Ev 520 wafer bonder. We plan to disconnect and move out on Thursday 8/22/13. The Heidelberg uPG101 Mask writer is in this group, we hope to delay disconnect and move until ~ Tuesday 9/3. We hope to have release and approval to power up best case ~ 9/10 with return to available status within 1-2 days.
For 8/22 move we plan to add on packaging equipment - NdYAG Laser Mark, Optec KrF laser and CMP for move into CMP room. Down time for packaging equipment should be less than 2 weeks.
We anticipate the Group 2 (remaining research photo/litho) equipment to begin disconnect and move after the Group 1 is operational.
Tools are moving from MEB to SMBB in phases. Items and timing described at the equipment move plan page. The dicing saws and CMP will be among the first to move.
Today, we sent out the Summer 2013 edition of our quarterly newsletter. Get an update on all of our ongoing projects and acquisitions by browsing through the news items in the archive. If you are not on our mailing list, please sign up so we can keep you posted.