DEPOSITION
- Agnitron Imperium Ga2O3, GeO2 Growth – (Lab A)
- Cambridge Fiji F200 – ALD Atomic Layer Deposition (Bay G)
- Denton Discovery 18 -(Bay F)
- Denton 635 -(Bay F)
- Denton SJ20C – (Bay F)
- SCS PDS 2010-Parylene Coater (Prototyping Room)
- TMV Super – (Bay F)
DRY ETCHING
- Oxford 100 ICP – (Bay E)
- XACTIX X2 XeF2 – (Bay E)
- Oxford Plasmalab 80 – (Bay E)
- Plasmatherm Metal Etch – (Bay E)
- Technics PE II-A – (Bay E)
FURNACES
- ProTemp Clean Ox – (Bay G)
- ProTemp Doped Ox – (Bay G)
- CTR LPCVD POLY, NITRIDE, AND LTO – (Bay F)
- Allwin AccuThermo AW 610 RTP – (Bay G)
- Blue-M Box Furnace – (Backend Lab)
LASER SYSTEMS
LITHOGRAPHY
Spin Coaters:
Aligners:
Ovens:
- Binder FD53-UL – (Bay C)
- Memmert Glass 250 Oven – (Bay C)
- Memmert N2 300 Oven – (Bay C)
- YES HMDS1 Oven – (Bay C)
- YES LP-III Oven – (Bay C)
MEASUREMENT
- Film Stress Tencor FLX-2320 – (Metrology)
- 4-point Probe Microtech RF-1 – (Bay F)
- Nanospec 3000 – (Metrology)
- N and K 1500 Analyzer – (Metrology)
- Profilometer Tencor P-10 – (Metrology)
- Profilometer Tencor P-20H – (Bay F)
MICROFLUIDICS
- VWR 1410 Vacuum oven – (Lab B)
- March Plasmod Barrel RIE – O2 – (Lab B)
- Enercon Dyne-A-Mite Ozone Plasma – (Lab B)
- CEE 200X PDMS Spinner – (Lab B)
MICROSCOPY
PACKAGING
- Disco DAD3220 – (Backend Lab)
- Disco DAD641 – Dicing Saw (Backend Lab)
- EVG 520 IS – Wafer Bonder (Bay C)
- MEI Wedge – Wire Bonder (Backend Lab)
PATTERN GENERATION
- Heidelberg DWL66+ – (Bay A)
- Heidelberg MicroPG 101 – (Bay B)
- Heidelberg MicroPG 101-2-0.9um-2.5um – (Bay B)
- Nanoscribe 3D Photonic Pro GT – (Bay B)
- NanoFrazor Explore – (Bay B)
PCB Manufacture
TEST & ELECTRICAL CHARACTERIZATION
- Keithley 4200 SCS – IV Micromanipulator Probe Station (Bay M Metrology)
- Micromaniuplator Probe Station
UV IR MAGNETIC MEASUREMENT DEVICES
- UV Intensity Meter OAI 306
- UV Intensity Meter OAI 357
- FLIR handheld IR camera
- Bell 5180 Gaussmeter
Facilities