Tool Owner
Joseph Jacob (joseph.jacob@utah.edu)
Reservations Calendar
S/N: 9M69591A
- One controller for both RIE and PECVD
- PECVD Capabilities
- Amorphous Si
- Si3N4
- SiONx
- SiO2
- PECVD Source Gases Available
- SiH4, N2, N2O, NH3, Ar
Process Information
Oxford 80+ Characterization Results Summer 2010 Etch Rates and Process Parameters
Download Files
Files
Characterization:
Oxford 80- Characterization Results Summer 2010 Etch Rates and Process Parameters
SOP:
Oxford Plasmalab 80 SOP in PDF Format
Spec Sheet:
Staff Files
Logs:
Manuals:
Manuals From CD:
SOP:
Oxford Plasmalab 80 SOP in Word Format
Run-Data Reports for Oxford Plasmalab 80
| Processes on Oxford Plasmalab 80 | |||
|---|---|---|---|
| aborted | |||
| oxford-80-etch | |||
| service | |||
| standard-logs | |||
| runs-without-data | |||
| Download Combined Report (XLS) |