Request Equipment Training or Service You must be a member to sign up for training or service. If you haven’t already, signed up to become a member here. Equipment Training or Service Request Form Set up Is this a training or service? * TrainingService User Information First Name * Last Name * Email Address * Substrate Substrate Material * SiliconGlassQuartzSapphireOther Substrate Material Substrate size (mm) * Substrate thickness (mm) * Number of Substrates to fabricate/inspect/test * Other Description Films What Films are already on the substrate? List in order on both sides. * What thickness are the films in nanometers? * What pre-existing patterns are on the films? * Equipment Selection Select only one piece of equipment for each training event. Aligners EV 420OAI 200OAI 800SUSS MA1006 Deposition_Tools Agnitron Imperium GAOCambridge FIJI F200Denton Discovery 18Denton 635Denton SJ20CSCS PDS 2010TMV SUPER Dry Etching OXFORD 100 ICPOXFORD PLASMALAB 80PLASMATHERM METAL ETCHTECHNICS PE II-AXACTIX X2 XEF2 Furnaces ALLWIN ACCUTHERMO AW 610 RTPBLUE-M BOX FURNACECTR LPCVD FURNACESPROTEMP CLEAN OXPROTEMP DOPED OX LASER Systems DPSS UV LASER MARKERUNIVERSAL LASER PLS6.150DLASERSTAR 1900 WELDER Measurement FILM STRESS TENCOR FLX-23204-POINT PROBE MICROTECH RF-1NANOSPEC 3000N AND K 1500 ANALYZERPROFILOMETER TENCOR P-10PROFILOMETER TENCOR P-20H Microfluidics VWR 1410 VACUUM OVENMARCH PLASMOD BARREL RIE – OENERCON DYNE-A-MITE OZONE PLASMACEE 200X PDMS SPINNER Microscopy KEYENCE VHX-5000 MICROSCOPE Ovens BINDER FD53-ULMEMMERT GLASS 250MEMMERT N2 300YES HMDS1YES LP-III Packaging DISCO DAD3220DISCO DAD641EVG 520 ISMEI WEDGE Pattern_Generation HEIDELBERG DWL66+HEIDELBERG MICROPG 101HEIDELBERG MICROPG 101-2-0.9UMNANOSCRIBE 3D PHOTONIC PRO GTNANOFRAZOR EXPLORE Photolithography Photolithography Spin Coaters CEE 100CEE 200X 1800 SPINNERCEE 200X 9260 SPINNERCEE 200XD DEVELOP SPINNERHEADWAY EC101 Test & Electrical Characterization KEITHLEY 4200 SCSKEYSIGHT 404A MIXED SIGNAL OSCILLOSCOPEKEYSIGHT E5061B NETWORK ANALYZEROscilloscope Tektronix TDS 2002 BMicromaniuplator Probe Station UV IR Magnetic Measurement Devices UV Intensity Meter OAI 306UV Intensity Meter OAI 357FLIR handheld IR cameraOption 4Bell 5180 Gaussmeter Preferred Training Schedule Preferred training date and time will depend on tool and staff availability. 1st Preferred Training Date * 1st Preferred Training Time * 08091011121314151617 : 0030 2nd Preferred Training Date * 2nd Preferred Training Time * 08091011121314151617 : 0030 3rD Preferred Training Date * 3rd Preferred Training Time * 08091011121314151617 : 0030 Dicing Section Please select the tape type to be used for dicing. * Blue Tape (130um thickness)UV Tape (160um thickness) Requires UV exposure to release Blade thickness * .250 (Silicon, Glass, Quartz).090 (Silicon)Other Blade thickness How is your device being protected during the dicing process? * Device is covered with photoresistDevice is covered with blue tape.Device is covered with UV tape.Other How is your device being protected during the dicing process? Does your device have alignment marks to use for dicing? YesNo List the X dimension (mm) of your device or streets. * List the Y dimension (mm) of your device or streets. * Special instructions. File Upload Drop a file here or click to upload Choose File Maximum file size: 419.43MB Upload a drawing of your device to show device, tape, films, etc. The fields below are to be used by Staff. Blade type used for project VT07 SD400 VC100 75 57x0.25A3x40-L #400 (35um)P1A850 SD320R10MB01 58x0.250x40 #320 (46.2um)P1A851 SD600R10B01 54x0.25x40 #600 (25.8 um)NBC-Z 1070 52x0.09x40 #1500 (12.6um)NBC-Z 1050 53x0.07x40 #2000 (10.3um)B1A801 SD200N75M42 56x0.15x40 #200 (75um)Z09-SD4800-Y1-60 51.8x0.04ASx40 #4800 (~5um)Other Blade type used for project Dicing Speed Notes Inspection & Metrology Tools Describe details for measurements. 3D Microprinting (Nanoscribe) Overall print dimensions (x, y, z) List the dimensions (x, y, z) Minimum feature size List the minimum feature size. Desired resin List the desired resin Objective 10X 25X 65X Upload STL File Drop a file here or click to upload Choose File Maximum file size: 419.43MB Mask making (Heidelbergs) Minimum feature size Overall design dimensions X by Y Dark field or light field Dark Field Light Field Alignment Marks Street widths/dicing spacing Design CAD file type: DFX GDS OtherOther Upload CAD File for review Drop a file here or click to upload Choose File Maximum file size: 419.43MB Wirebonding Chip size X, Y, Z in mm Chip bond pad details HeightHeight WidthWidth ThicknessThickness MaterialMaterial Package size X, Y, Z in mm Photolithography Spinner * Substrate * Material * Liftoff or etch mask? Lift off Etch mask Material to be lifted off or etched Thickness of layer(s) to be lifted off or etched? Substrate precleaning (Acetone/IPA, O2 RIE, Piranha, hot plate bake, etc) HMDS adhesion promotor required? Deposition What materials do you want to deposit? * What thickness are the materials in nanometers? * If you are human, leave this field blank.