Tool Owner
Joseph Jacob (joseph.jacob@utah.edu)
Reservations Calendar
- Four 6″ rotating substrate holders
- Dual-chamber with independently cryopumped load lock
- Base pressure 2×10-7 torr, sputtering pressure controlled using gas flow combined with a foreline butterfly valve.
- Six cathodes configured for variations of sequential or simultaneous sputtering or reactive sputtering configurable with any of the fitted power supplies.
- Precious Metals: Pt, Au, Ir
- Adhesion Layers: Ti, Cr, TiW
S/N: 1N15840103
Process Information
Download Files
Files
Characterization:
TMV Characterization Procedure
SOP:
Sputter Rates:
Uniformity:
Staff Files
Logs:
Manuals:
granville-phillips 358 micro-ion controller
SOP:
Run-Data Reports for TMV Super
| Processes on TMV Super |
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