Tool Owner

Joseph Jacob (joseph.jacob@utah.edu)

Reservations Calendar

• Automated sputter deposition of metals, alloys, and insulating thin films
  • Four confocal cathodes, inclined 25 degrees off vertical
  • Std targets 4″ Au, 4″ Cr, 3″ Pt, 3″ Ti
  • Other targets by arrangement with staff
• Film thicknesses controllable from a few nm to hundreds of nm
• Sputter power supplies, DC1 pulse or DC, DC2, RF1
• Switch-control any supply to any cathode
• Co sputter capable
• Substrate sputter pre-clean with RF2 supply
• PEM controllable reactive sputtering (Nitrogen or Oxygen)
• 8″ Diameter stage
• Substrate rotation
• +/- 5% Uniformity
• Cryo pumped to 5 x 10^-8 Torr
• Substrate heat up to 500 C (heated stage installed)
• Liftoff deposition with water-cooled stage (std configuration)
• Argon pressure range < 1-90 mT controllable with APC and 100 sccm MFC controller