LTO, NITRIDE, AND POLY LPCVD
Tool Owner
Kathy Anderson (kathy.anderson@utah.edu)
Process Overview
- Four inch substrates are placed vertically into a quartz cassette. The cassette is loaded onto a paddle which is moved into the quartz furnace chamber.
- Low Pressure Chemical Vapor Deposition chambers operate at low pressure and high temperature with incoming process gases that react on the substrate surface resulting in a thin film of material.
- Unlike thermal oxidation, deposition does not consume the silicon from the substrate.
- Recipe names, below, are linked to the Design Your Process builder where deposition times are calculated given target thickness and according to observed deposition rates.
- The Design Your Process builder also displays full run times next to deposition times. Note that full run times are generally greater than 3 hours time, due the time it takes to vent the chamber, pull, load, push, pump down, ramp up in temperature, dep, ramp down, vent and pull.
| Equipment | Process Name | Temp °C | Pressure mTorr | Resulting Material | ||||
| LTO/PSG |
PSG 450C 200mT |
400 400 450 |
300 300 200 |
O2 O2 O2 |
NH3 NH3 NH3 |
SiH4 SiH4 SiH4 |
PH3 PH3 |
Deposited (not thermally grown) SiO2 Phosphosilicate Glass Phosphosilicate Glass |
| NITRIDE |
825 825 780 |
200 200 200 |
NH3 NH3 NH3 |
SiH4 SiH4 SiH4 |
Si3N4 Low Stress, Si3N4, target stress 200MPa Si3N4 Stoichiometric or Si rich |
|||
| POLY |
630 630 |
200 250 |
SiH4 SiH4 |
PH3 |
Polysilicon undoped Polysilicon n-doped with Phosphorus |
SOP
Materials allowed/not allowed by NMR
Substrates allowed: Silicon, quartz, silicon carbide, silicon dioxide, silicon nitride, polysilicon
| Equipment | Allowed Materials | Material Exclusions |
|
LTO/PSG, NITRIDE, and POLY |
Silicon Quartz SiC SiO2 Si3N4 Polysilicon |
Kapton tape, glass, or metals allowed on substrates. Residual photoresist from previous photolithography steps must be removed by a pre-furnace wetclean as described in SOP. |
Training Videos
HSC Reservation Training Video CTR Nitride with Measurements Training Video Furnace Data Collection Training Video
Reservations Calendar
CTR Nitride Process Characterization
A statistically designed experiment has been performed and analyzed in JMP to provide additional information for Low Stress Nitride. Click HERE to access the analysis, which includes an interactive profiler where the values of the process variables can be changed showing the effect on the film characteristics. CTR Furnaces Parts List
Poly Recipes Run Data: 
