Tool Owner
Joseph Jacob (joseph.jacob@utah.edu)
Reservations Calendar
S/N 721002
Etching
- Etch Gases: SF6, CF4, O2, Ar, N2, CHF3, C4F8
- Cryo DRIE up to 5 um/min
- 4″ Wafers, 6″ or 8″ wafers with clamp change
Images
High Aspect Ratio:
Minimal Undercut:
Process Information
Oxford 100 DRIE SF6/C4F8 Log Sheet
Cross Section Pictures of Results: High Aspect Ratio No Undercut
Run-Data Reports for Oxford 100 ICP
| Processes on Oxford 100 ICP |
|---|
| aborted |
| oxford100 |
| service |
| standard-logs |
| runs-without-data |
Download Combined Report (XLS)
Download Files
Files
Material Etch Rates:
Oxford 100 Material Etch Rates Aug 2011
Process Information:
SOP:
Oxford 100 Cryo DRIE SOP in PDF Format
Oxford 100 ICP 2-Step DRIE SOP in PDF Format
Oxford 100 Processes and Repeatability
Spec Sheets:
Description section from Oxford 100 Manual.pdf
Member Files
Process Information:
Oxford 100 – 9260 Etch Characterization
Staff Files
Manuals:
University-of-Utah-94-721002-System-Manual
SOP:
Oxford 100 Cryo DRIE SOP in Word Format
Oxford 100 ICP 2-Step DRIE SOP in Word Format
Run-Data Reports for Oxford 100 ICP
| Processes on Oxford 100 ICP | |||
|---|---|---|---|
| aborted | |||
| oxford100 | |||
| service | |||
| standard-logs | |||
| runs-without-data | |||
| Download Combined Report (XLS) |