The Utah Nanofab is pleased to announce the hiring of Steve Pritchett as a Senior Process Engineer supporting the nanofab transition into the SMBB(USTAR building).

Come talk with Steve when you need assistance in developing or characterizing new processes, as he specializes in dep, etch, and CMP processes.  You can find him in 1280 MEB, fab office phone (801) 585-5676 or email spritchett@eng.utah.edu

Steve comes to us with a wealth of electronic packaging, semiconductor device and optical products manufacturing experience. At MOXTEK Steve covered thin film deposition and capacity/fab expansion projects. At Fairchild/National Semiconductor, Steve worked in process development for thin films and for product development their CSP’s (Chip Scale Packages).  The CSP work involved bumped contacts, wafer grind and etch for thinning and backmetal. Steve started his career at a small company acquired by National Semiconductor, Comlinear Corp., where he supported hybrid and MCM electronic product fabrication and assembly, based on a ceramic thin film substrate in hermetically sealed packages.