JIM PIERCE

Office: SMBB 2528
Phone: (801) 587-1219
Email: jim.pierce@utah.edu
Hours: 7:00am-4:00pm

Brief Bio:

  • A.S Electronics – ITT Tech, 1991
  • B.S. Computer Science – Nanotechnology, Utah Valley University, 2008
  • Fairchild Semiconductor (West Jordan, UT): 24 years, Development and Process Engineering
  • Moxtek (Orem, UT): 10 years, Development and Process Engineering
  • Multiple publications and patents
  • Hobbies: Music & Outdoors

Cleanroom/Backend Lab Responsibilities:

  • Safety, Training, Engineering support for service requests, process development, maintenance, process and materials characterization, and consultation of the following equipment:
  • Cambridge Fiji F200 ALD Processes available AL2O3, HfO2, SiO2 Processes on hold TiO2, Pt
  • Denton SJ20C E-beam evaporator – Ag, Al, Au, Al2O3, Co, Cr, Cu, Fe, ITO, Mo, Ni, NiCr, SiO2, Ti, Pt
  • CHA E-beam evaporator – In
  • Denton 18 Sputter – Al, C,r Ti, Au, W, ITO, Ag, Cr, Ni, NiFe 80:20, Si,  SiO2, Ta,  YSZ, NbTi 50:50, NiCr, GsSbTe, Mo, TiW, Pt, Cu, TiO2, WC, Ge,  Sn,  LaB6, Al1%Si
  • Denton 635 Sputter – ITO 3″, ITO 4″, Al 3″, Al 4″, Au 4″, Cr 4″, Ti 3″, Pt 3″, NiCr 4″, Mo 3″, Cu 4″, W 3″, SiO2 3″, Ir 5mT 3″, Ir 10mT 3″, IrOx 5mT 3″, IrOx 10mT 3″, IrOx 15mT 3″, Co 4″, Ti 4″ C1, Co 4″, C2 Nb 3″, C4 Cu 3″
  • Disco DAD 641
  • Disco DAD 3220
  • LPKF ProtoMat S104 PCB milling machine
  • MEI wedge wire bonder – Al, Au wire
  • N & K
  • Nanospec 3000
  • Flexus Film stress

Additional responsibilities:

  • NanoFab Website maintenance and updates
  • 5S and SPC and SOP improvements
  • Pump maintenance including roughing, turbo, cryo pumps and compressors.
  • TA and course training for various classes.
  • Target material maintenance, measurement and stocking.
  • Automation projects:
    • Design a Process
    • Chemical Inventory
    • Tool datalogging
    • Data logger data review applications.
    • HSC data scripts
    • Particle counter, temperature and humidity.