Request Equipment Training or Service You must be a member to sign up for training or service. If you haven’t already, signed up to become a member here. Equipment Training or Service Request Equipment Selection (Only pick one tool from any section) Tool choice for training or service. For which tool do you want training or service? ALD Cambridge FIJI F200E-Beam Denton SJ20CMOCVD Agnitron Imperium Ga2O3, GeOParylene SCS PDS 2010Sputter Denton Discovery 18Sputter Denton 635Sputter TMV SUPEREV 420OAI 200OAI 800SUSS MA1006Oxford Cobra PECVDSi DRIE/SiO2/SiN Etch OXFORD 100 ICPSi DRIE OXFORD COBRA 200mmMETAL RIE PLASMATHERMO2 RIE TECHNICS PE II-ASi Isotropic Etch XACTIX X2 XEF2RTP ALLWIN ACCUTHERMO AW 610BLUE-M BOX FURNACELPCVD CTR FURNACESOxide PROTEMP CLEAN OXDiffusion PROTEMP DOPED OXDPSS UV LASER MARKERUNIVERSAL LASER PLS6.150DFILM STRESS TENCOR FLX-23204-POINT PROBE MICROTECH RF-1Film Thickness NANOSPEC 3000Film Thickness N AND K 1500 ANALYZERStep Height PROFILOMETER TENCOR P-10Step Height PROFILOMETER TENCOR P-20HKEYENCE VHX-5000 MICROSCOPEBINDER FD53-ULMEMMERT GLASS 250MEMMERT N2 300YES HMDS1YES LP-IIIVWR 1410 VACUUM OVENMARCH PLASMOD BARREL RIE – OENERCON DYNE-A-MITE OZONE PLASMACEE 200X PDMS SPINNERDISCO DAD3220DISCO DAD641EVG 520 ISMEI WEDGEHEIDELBERG DWL66+HEIDELBERG MICROPG 101HEIDELBERG MICROPG 101-2-0.9UMNANOSCRIBE 3D PHOTONIC PRO GTNANOFRAZOR EXPLOREPhotolithographyCEE 100CEE 200X 1800 SPINNERCEE 200X 9260 SPINNERCEE 200XD DEVELOP SPINNERHEADWAY EC101KEITHLEY 4200 SCSOscilloscope Tektronix TDS 2002 BMicromaniuplator Probe StationCHA E-beam Evaporator Set up Is this a training or service? * TrainingService What HSC account will be billed? * Enter the date of your Safety Training Walk-Through. * If you have not had a Safety Training Walk-Through you cannot schedule training services. User Information First Name * Last Name * Email Address * Substrate Substrate Material * SiliconGlassQuartzSapphireOther Substrate Material Substrate size (mm) * Substrate thickness (mm) * Number of Substrates to fabricate/inspect/test * Other Description Films What Films are already on the substrate? List in order on both sides. * What thickness are the films in nanometers? * What pre-existing patterns are on the films? * Preferred Training Schedule Pick 3 different dates. Preferred training date and time will depend on tool and staff availability. 1st Preferred Training Date * 1st Preferred Training Time * 080910111213141516 : 0030 2nd Preferred Training Date * 2nd Preferred Training Time * 080910111213141516 : 0030 3rD Preferred Training Date * 3rd Preferred Training Time * 080910111213141516 : 0030 Dicing Section Please select the tape type to be used for dicing. * Blue Tape (130um thickness)UV Tape (160um thickness) Requires UV exposure to release Blade thickness * .250 (Silicon, Glass, Quartz).090 (Silicon)Other Blade thickness How is your device being protected during the dicing process? * Device is covered with photoresistDevice is covered with blue tape.Device is covered with UV tape.Other How is your device being protected during the dicing process? Does your device have alignment marks to use for dicing? YesNo List the X dimension (mm) of your device or streets. * List the Y dimension (mm) of your device or streets. * Special instructions. File Upload Drop a file here or click to upload Choose File Maximum file size: 419.43MB Upload a drawing of your device to show device, tape, films, etc. The fields below are to be used by Staff. Blade type used for project VT07 SD400 VC100 75 57x0.25A3x40-L #400 (35um)P1A850 SD320R10MB01 58x0.250x40 #320 (46.2um)P1A851 SD600R10B01 54x0.25x40 #600 (25.8 um)NBC-Z 1070 52x0.09x40 #1500 (12.6um)NBC-Z 1050 53x0.07x40 #2000 (10.3um)B1A801 SD200N75M42 56x0.15x40 #200 (75um)Z09-SD4800-Y1-60 51.8x0.04ASx40 #4800 (~5um)Other Blade type used for project Dicing Speed Notes Inspection & Metrology Tools Describe details for measurements. 3D Microprinting (Nanoscribe) Overall print dimensions (x, y, z) List the dimensions (x, y, z) Minimum feature size List the minimum feature size. Desired resin List the desired resin Objective 10X 25X 65X Upload STL File Drop a file here or click to upload Choose File Maximum file size: 419.43MB Mask making (Heidelbergs) Minimum feature size Overall design dimensions X by Y Dark field or light field Dark Field Light Field Alignment Marks Street widths/dicing spacing Design CAD file type: DFX GDS OtherOther Upload CAD File for review Drop a file here or click to upload Choose File Maximum file size: 419.43MB Wirebonding Chip size X, Y, Z in mm Chip bond pad details HeightHeight WidthWidth ThicknessThickness MaterialMaterial Package size X, Y, Z in mm Photolithography Spinner * Substrate * Material * Liftoff or etch mask? Lift off Etch mask Material to be lifted off or etched Thickness of layer(s) to be lifted off or etched? Substrate precleaning (Acetone/IPA, O2 RIE, Piranha, hot plate bake, etc) HMDS adhesion promotor required? Deposition What materials do you want to deposit? * What thickness are the materials in nanometers? * Captcha If you are human, leave this field blank.