Printable PDF Equipment List: https://www.nanofab.utah.edu/wp-content/uploads/2022/08/tool-list.pdf

Equipment Pages: https://www.nanofab.utah.edu/wiki/new-equipment-page/

Cleanroom

DESIGN & SIMULATION SOFTWARE

• L-Edit, Cadence, AutoCAD, SolidWorks
• Link-CAD DXF/GDSII/CIF/BMP conversion tools
• SASS JMP statistical design of experiments (CADE)
• ANSYS & COMSOL finite element analysis

 LITHOGRAPHY (Class 100) Pattern Generation & Direct Write

• Nanoscribe Professional GT-2 micro/nano 3D printer: 200nm-mm scale printing on silicon and glass. IP-DIP, IP-S, IP-Q, IP-Visio, IP-PDMS, GP-Silica, IP-n162 Resins
• Heidelberg DWL66+ Laser Pattern Generator submicron 0.3mm (300nm) min lines and spaces, gray-scale patterning, direct write up to 200mm substrates and 9” photomasks.
• Heidelberg µPG 101 Laser Pattern Generator (x2)

0.9mm, 2.5mm write heads, gray scale lithography

• Nanofrazor 30nm-200nm nanolithography tool
• EVG EV-420, Suss MA1006 front & backside mask aligner
• OAI Models 200 & 810 (with BSA) contact aligners
• SSEC 3305 Auto spin/bake HMDS/PR/EBR track
• Spinners, ovens, hot plates, fume hoods, SRDs, ultrasonic lift-off. CEE Apogee spinner/bakeplate.
• LOR 10B, AZ 9620, Shipley 1813, nLOF 2020, AZ 40XT, SU8, ma-P 1275, AZ Barlii II ARC, AZ MiR 701
• YES HMDS vapor prime vacuum oven

THIN FILM DEPOSITION (Class 1000)

Sputtering:

• TMV SS-40C: 8 dedicated cathodes, dual cryo-pumped
• Denton Discovery 18: 3 user config 3” cathodes, RF/DC/Reactive/Heated sputtering.
• Denton 635LL: 4-cathodes, RGA, OES-feedback reactive oxygen or nitrogen sputter, heated/cooled chuck to 500C, co-sputtering, coats up to 200mm diameter substrates

Precious Metals: Ag, Au, Ir, Pd, Pt, Ru

Other Metals/Alloys: Al, Al/Si, BN, C, Chromel, Co, Cr, Cu, Cu/Ag, Ge, Fe, Ni, NiCr, NiCrFe, Nb, Si (p-type), Ta, Ti, TiW, V, W, Cr₂Si, Zr, Hf

Oxides / Ceramics: Al₂O₃, AlN, SiO₂, IrOx, ITO, BN, CeSm(ox), LaSrFe(ox), NaMnO₃, NdMgO, SiC, Si₃N₄, TaO₂, TiO₂, YNiZrO, YSZ, ZnO, MgO

Evaporation: Al, Ag, Au, Au/Ge, Cr, Cu, Mo, NiCr, Ni, Ta, Ti

• Denton e-beam DV-SJ/20C with four hearths, user configurabl

PECVD

• Oxford Plasmalab 80+: a-Si, low-stress Si₃N₄, SiO₂

CVD

• SCS PDS 2010 Parylene-C

MOCVD

• Agnitron Agilis-IH: Gallium Oxide, Germanium Oxide

ALD

• Cambridge Fiji F200 w/ thermal & plasma dep modes, H₂O plasma (Pt, HfO₂, ZnO, Al₂O₃, SiO₂, TiO₂, MgO, ZrO₂)

FURNACES and DIFFUSION  (Class 1000)

Equipment	Process Temp °C	Process Gases	Resulting Material	Material Exclusions
LPCVD Furnace LTO/PSG		Oxygen Silane Phosphine Nitrogen	Deposited SiO2 or Phosphosilicate Glass	No photoresist or metals allowed on substrates
LPCVD Furnace NITRIDE		Dichlorosilane Ammonia Nitrogen	Si3N4 Low Stress, Stoichiometric or Si rich	No photoresist or metals allowed on substrates
LPCVD Furnace POLY		Silane Nitrogen	Polysilicon undoped or p-doped	No photoresist or metals allowed on substrates
RTP/RTA Allwin 610	200-125	Oxygen Nitrogen Argon Forming gas	Anneal	No photoresist
Atmospheric Furnace CLEANOX	1050		Thermally grown SiO2	No photoresist or metals allowed on substrates. No previous solid source doping steps
Atmospheric Furnace DOPEDOX			Transfer of solid source phosphorus or boron Thermal oxidation	No photoresist or metals allowed on substrates
Blue M Box furnace			Nitrogen Purge enables anneal with reduced oxygen ambient
Vacuum Oven			Volatile materials removal at 250°C

ETCH  (Class 1000)

RIE and DRIE

• Oxford Plasmalab 100+ ICP DRIE Bosch & cryo,

SF₆, CF₄, CHF₃, O₂, Ar, N₂

• Oxford Cobra (SF₆, CF₄, O₂, Ar)
• Technics PEII H₂O vapor, O₂ descum & resist strip
• Xactix Xetch XeF₂ silicon isotropic dry etch
• Plasmatherm 790 metal etch (Cl₂, BCl₃, SF6, CF4, O2, Ar)

Wet Chemical

• Bold & WAFAB wet benches (x6) acids, bases, organics
• Gold wet-etch station

MICROMACHINING / MESO-SCALE PROTOTYPING

• KOH bulk Si micromachining etch station
• ULS CO₂ flatbed laser (dual laser cartridge, 25W + 75W, 1090nm)
• DPSS Samurai UV laser (355nm, 10um spot size, 3 W)

BACKEND PROCESSES & PACKAGING

• EVG 520IS wafer bonder (anodic, eutectic, polymer, fusion)
• Disco DAD 641 & Disco 3220 dicing saws (std or UV tape)
• MEI wedge wirebonder with Au and Al wire
• LPKF Protomat
• LPKF Contac 4 Electroplater

CLEAN (Class 10,000) MICROFLUIDICS

• Sylgard 184 PDMS
• SU-8 soft lithography and PDMS bonding
• Omnicure 1000 UV curing (320-500nm)
• Lamination press, spinner, vacuum oven, hotplate
• Corona discharge UV/O₃ plasma treatment

CLEANROOM (Class 1000) METROLOGY

• JEOL JSM-IT200LV Inspection SEM
• Keyence VHX-5000 3D measuring microscope
• n&k NKT 1500 thin film analyzer with wafer mapping
• Nanometrics NanoSpec 3000 film thickness
• Filmetrics F20 & F40 small spot film thickness and refractive index
• Magnetron Instruments 4-point probe
• Polyvar Met with DIC + many optical microscopes
• Tencor P-10 and P-20 stylus profilometers
• Tencor Flexus 2320 film stress analyzer

ELECTRICAL / MAGNETIC TESTING

• Verigy 9300 SOC IC tester
• Keysight 404A Mixed Signal O-scope
• Keysight E5061B Network Analyzer
• Keithley 4200A semiconductor parameter analyzer (four SMUs + positioning microprobes)
• Micromanipulator light-tight micro probe station

CLEANROOM STAFF SERVICES

• Sign up to use the Nanofab: https://www.nanofab.utah.edu/get-access-to-our-lab/
• Professional technical support questions https://www.nanofab.utah.edu/lab-staff/#process
  • 3D microprinting on Nanoscribe GT2 Pro
  • Photomask design and generation
  • Wafer/chip design and fabrication
• Microfluidics
• Microoptics (lenses, diffractive optical elements)
• MEMS and microactuators
• Microsensors
• Multi-electrode arrays
• Thin film deposition, lithography, and patterning
• R&D process development
• Equipment installation, diagnostics, and repair
• FLIR