Tool Owner

Jim Pierce (jim.pierce@utah.edu)

Reservation Calendar

• Designed for:
  • Ultrasonic wedge bonding
  • Thermosonic wedge bonding
  • Thermocompression wedge bonding
• Of:
  • IC’s
  • Hybrids
  • Microwave devices
  • Laser diodes
• Using gold or aluminum wire from .5 mil (12.5 microns) to 3 mil (76 microns) and ribbon.

Manufacturer Information:

Mech-El website

Download Files

Files

SOP:

Wirebonder SOP in PDF Format

Spec Sheet:

Spec Sheet MEI 1204w Wedge Bonder Manual.pdf

Staff Files

Manual:

MEI 1204w Wedge Bonder Manual.pdf

SOP:

Wirebonder SOP in Word Format